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MediaTek Announces Dimensity 800 SoC With 5G; To Debut At CES 2020

MediaTek recently announced the existence of the Dimensity 800, a new SoC targeted at smartphone makers looking to launch mid-range devices in 2020. The new chipset, which is said to be a step below the current Dimensity 1000L on the hierarchy, is expected to come with an integrated 5G modem.

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Unfortunately, there’s not a whole lot of information about the Dimensity 800. Despite its announcement at a press conference in Beijing, MediaTek didn’t let on further about the rest of its specification. Instead, the semiconductor brand simply said the SoC will be demoed at CES 2020, which is just a couple weeks off.

On the surface, the Dimensity 800 is expected to bump heads with Huawei’s Kirin 800 series SoC and Qualcomm’s next batch of Snapdragon 700 series chipsets. In regards to its 5G modem, it appears that the modem is the same as the one being used in the Dimensity 1000L. And has a 4.7Gbps downlink and 2.5Gbps uplink, as well as support for both SA and NSA networks.

MediaTek announced its Dimensity 1000L 5G chipset back in November. Built on a 7nm die lithography, it is one of the few chipsets that boasts a single-chip solution with an integrated 5G modem.

(Source: ITHome via GSMArena)

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